Thermal Management & Flame Proof
| Technical Specifications | |||
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| Thermal Conductivity | 1.0 W/mK to 15.0 W/mK | ||
| Thickness Range | 0.5 mm to 15 mm (customized thickness up to 250 mm available) | ||
| Key Properties |
-50°C to +230°C (Epoxy version)
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Highly Electrically Insulating
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Low Stress, Natural Tack for excellent surface wetting
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High reliability under thermal cycling
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Excellent gap filling ability
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Designed for automated assembly and dispensing
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| Operating Temperture |
-50°C to +230°C (Epoxy version)
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Higher ratings based on silicone variant and application
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| Materfar Types |
Silicone-based thermal pads
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Epoxy-based pads for high hardness
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Foam-based pads for battery packs (UL 94 V0 compliant)
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Ceramized options for specialty high-temp needs
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| Applications |
EV Battery Pack BMS Modules
Traction Motors
Power Controllers
OBC, DC–DC Converters
Telecom Power Units
LED Lighting Modules
High-speed Computing Devices
Inverters
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| Manufacturing Update (India) |
Local production planned at Ranipet Plant (60 km from Chennai)
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Full-scale manufacturing of Thermal GAP Pads expected to begin by: ,
- Q2 2025 (EEM) for standard pads - Q4 2025 for flame-retardant foam pads |
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Flame Retardant Foams for Li-ion Battery Packs
DSF Series – Silicone Foam Pads
MD FOAM Series – PU Foam Materials
| Technical Specifications | ||
|---|---|---|
| DSF Series - Silicone Foam Pads |
UL 94 VO Compliant
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Thickness: 1 mm to 12 mm
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Withstand high temperature
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Low Density for lightweight applications
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Ceramized Foam Pads also available for special applications
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Available with one side adhesive for easy application
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| MD FOAM Series - PU Foam Materials |
PU-based foam
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Low Density
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Flame Retardant Potting
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UL 94 VO Rated
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Operating Temp: -40C to +130C
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5 Times Foaming Ratio
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Both Gap Fillers and Gap Pads are part of the Thermal Management product family. They are used for thermal interface applications to fill air gaps and transfer heat between components.
| Technical Specifications | ||
|---|---|---|
| Gap Fillers |
Thermal Conductivity: 1 W/mK ~ 6.0 W/mK
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Low Stress, Non-sag, and Pre-cured GELs
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Reworkable and UL 94 VO Flame Retardant
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Excellent Gap Filling, Low Thermal Resistance
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Thickness Range: 0.5 mm to 250 mm
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Suitable for automated dispensing
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| Gap Pads |
Thermal Conductivity: 1 W/mK ~ 15 W/mK
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Thickness Range: 0.5 mm ~ 250 mm
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UL 94 VO Flame Retardant
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Highly Electrically Insulating
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Low Compression Stress
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Available with natural tack for surface wetting
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Materials Overview
| Category | Specifications |
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| Gels Pre-cured Gels / Silicone Gels / Thermally Conductive Gels |
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| Foams Structural Adhesives, Sealants, PUR Adhesives |
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| Adhesives Flame Retardant Foam Pads (Silicone & PU Based) |
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Gels
Precured Gels / Silicone Gels / Thermally Conductive Gels
- Thermal Conductivity: 2.0 to 7.0 W/mK
- Low Stress, reworkable
- Flame Retardant (UL 94 V0)
- For automated dispensing and tight tolerances
- Suitable for vertical alignment (non-sag)
Foams
Structural Adhesives, Sealants, PUR Adhesives
- UL 94 V0 Certified
- Lightweight, low-density
- Thickness: 1 mm to 12 mm
- PU versions have >5x Foaming Ratio
- Available with one side adhesive
- Used in Battery Packs & EV modules
Adhesives
Flame Retardant Foam Pads (Silicone & PU Based)
- 1K & 2K Acrylic Resins: Fast cure, −40°C to +130°C
- 2K Polyurethane Resins: Good pot life, bonding, environmental protection
- 1K & 2K Silicones: Gap filling, high-temp resistance up to 300°C
- 1K & 2K Epoxies: Strong bonding, high chemical and temperature resistant
