EEM - Products

Low Pressure Molding (LPM)

Low Pressure Molding (LPM) is a PCB protection solution using thermoplastic polyamide resins molded at low pressure to encapsulate delicate components. It's a clean, solvent-free, and environmentally friendly process ideal for automotive electronics and sensors.

Uses specialty thermoplastic polyamide resin
Achieves IP68 waterproofing
Can mold delicate electronic components without
Widely used in automotive electronics
Enables faster production cycles
Supports over-molding and strain relief

Silicone

Silicone potting materials are used for thermal management and PCB protection, especially where flexibility, electrical insulation, and wide temperature

Thermal Conductivity: 0.6 W/mK ~ 6.0 W/mK
Temperature Range: -50C to +230°C
Low Stress, Reworkable after curing
Excellent electrical insulation
Ideal for automotive control units (ECU, MCU, DC-DC, OBC)
Available in 1K pre-cured and 2K thermally conductive versions
Non-sag, suitable for vertical alignment

Epoxy

Epoxy potting compounds are thermoset materials that provide high mechanical strength, temperature stability, and chemical resistance, ideal for rugged

Thermal Conductivity: Moderate (varies by formulation)
Temperature Range: -60C to +260°C
Withstands Pressure >50MPa
Low Coefficient of Thermal Expansion (CTE)
High environmental resistance (resists acids, automotive fluids)
Provides excellent impregnation performance
Commonly used in PCB potting and transfer molding

PU

PU potting compounds offer flexibility, good workability, and medium-temperature performance, making them ideal for electronic assemblies needing vibration resistance and environmental shielding.

Temperature Range: -40C to +130°C
Good Pot Life & Fluidity
Reliable bonding with environmental protection
Low Coefficient of Thermal Expansion (CTE)
Ideal for potting sensors, automotive modules, and mobile electronics
Provides excellent impregnation performance
Often used in 2K structural potting and foam potting (for battery packs)

Conformal Coatings

Conformal coatings are thin protective films applied over PCBs and electronic components to protect against moisture, dust, chemicals, and electrical shorts while maintaining electrical performance and mechanical flexibility.

Conformal Coatings - Silicone, Acrylic, Urethane Acrylate

Tri-proof protection: humidity, dust, and electrical insulation
Available in solvent-free, air-drying, and UV-curable versions
Excellent dielectric strength and chemical resistance
Suitable for automated or manual application
Chemistries include:
-Silicone coatings (high temperature, flexible)
-Acrylic coatings (fast cure, transparent)
-Urethane acrylates (UV-cure, robust surface finish)

Epoxy Transfer Molding

Epoxy Transfer Molding is a high-performance, thermoset encapsulation process that injects preheated epoxy into a mold to protect electronic assemblies.